ThreeBond 2274S

Underfill agent for mounting CSP and BGA

Market

  • Automotive Market

    Used for vehicle powertrains and electrical components, construction machines, and marine vessels.

  • Electronics Market

    Used for electrical appliances such as mobile phones and computers.

  • Public Industrial Material Market

    Used for infrastructure, construction, and general machines.

Function

  • Excellent Heat resistance

  • Fast Curing

  • Heat curing

  • High Tg

  • High strength

  • flowability

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Features / Technology

  • Adequate viscosity: Excellent flowability and rapid penetration, and excellent workability and spreadability
  • High reliability: High glass transition temperature and stable physical characteristics under actual environment of usage
  • High adhesion: Excellent adhesion to iron and glass epoxy
Main component Epoxy resin
Exterior Blue
Viscosity 3.8Pa･ｓ

Examples

CSP and BGA

Sealing and reinforcement (underfill)

Related Links

Online Catalog by series: 2000/2100/2200Series （別窓で開く）