ThreeBond 3301W
Solvent-free, Epoxy-based Conductive Adhesive, Ag Paste
- Market
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Electronics Market
Used for electrical appliances such as mobile phones and computers.
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- Function
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Heat curing
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Heat curing / Drying performance
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Heat resistance
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High strength
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Low-resistivity
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Features / Technology
- Solvent-free, and applicable not only to spot bonding, but also to surface bonding.
- Single-component, and can be used without operations, such as mixing.
- Less outgassing
| Main component | Epoxy type,Silver Type |
|---|---|
| Exterior | Silver |
| Viscosity | 35.0Pa･ｓ |
Examples
Crystal unit
Fixing
Other parts
Surface bonding and spot bonding