ThreeBond 3303M
Silicone-based conductive adhesive for SMD crystal oscillators, Ag Paste
- Market
-
-
Electronics Market
Used for electrical appliances such as mobile phones and computers.
-
- Function
-
-
Flexibility
-
Heat curing
-
Heat curing / Drying performance
-
※Membership registration or login is required to view SDS / technical materials.
Features / Technology
- One-part silicone-based conductive adhesive. It can be cured by heating at 180°C for 60 minutes.
- Since the adhesive is based on silicone resin, it shows relatively stable characteristics at low to high temperatures after curing.
- Less skinning after application. It is suitable for application in a small quantity.
- It can be used as a substitute for the existing silicone-based conductive adhesive TB3303F.
| Main component | Silicone |
|---|---|
| Exterior | Light yellow |
| Viscosity | 40.0Pa･ｓ |
Examples
Piezoelectric elements and electrodes on small-sized crystal oscillators, crystal oscillators and surface-wave elastic filters
Applicable to connection
Various parts and fixing of chip components
Applicable to spot-bonding