ThreeBond 3303N
Silicone-based conductive adhesive for SMD crystal oscillators, Ag Paste
- Market
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Electronics Market
Used for electrical appliances such as mobile phones and computers.
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- Function
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Flexibility
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Heat curing
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Heat curing / Drying performance
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Features / Technology
- One-part silicone-based conductive adhesive. It can cure at 180C in 60 min.
- After curing, it shows relatively stable characteristics in a wide temperature range because its base material is a silicone resin.
- Since it causes less skinning after applied, it is suitable for application in a minute quantity.
Main component | Silicone |
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Exterior | Light yellow |
Viscosity | 41.0Pa・s |
Examples
Piezoelectric elements and electrodes particularly of small quartz crystals, crystal oscillators and surface wave elastic filters
Connection
Various other parts and fixing of chip components
Spot bonding