Epoxy-based Heat-curing Electrically Conductive Adhesive, Ag Paste

Market

• Electronics Market

  Used for electrical appliances such as mobile phones and computers.

Function

• Flexibility

• Heat curing

• Heat curing / Drying performance

• Heat resistance

• High strength

• Low temperature curing

• Low temperature heat-curing

• Low-halogen

• Low-resistivity

※Membership registration or login is required to view SDS / technical materials.