Product List

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    • Long pot life at room temperature, low viscosity and excellent workability
    • Cures to a solid excelling in heat resistance and vapor resistance by heating
    • Displays high bonding strength
    • The base resin and curing agent are formed together. It is only necessary to cut and knead to cure the putty. No part of the putty will be wasted, and the working efficiency will be improved.
    • Excelling in fast curability. It starts curing after 2 to 3 minutes and can be machined by tools, such as a cutter, after 1 hour. Excelling in curability at low temperatures
    • It has excellent heat resistance.(Thermal decomposition starting temperature: 260°C)
    • The putty epoxy resin does not sag even on vertical surfaces.
    • Excellent lap shear strength
    • Well-balanced properties of cured agent
    • Formes a cured product with excellent tensile shear adhesive strength
    • This is a curing agent with excellent transparency
    • Well-balanced properties of cured agent
    • Quick curing at low temperatures (60°C or more)
    • Excellent adhesive properties
    • Excellent heat resistance
    • Trigger curing ability (mainly for bonding)
    • One-component heat-curing adhesive
    • Product conforming to ISO10993 (biological safety assessment)
    • Quick curing at low temperatures (60°C or more)
    • Excellent adhesive properties
    • Excellent heat resistance
    • Trigger curing ability (mainly for bonding)
    • Quick curing at low temperatures (60°C or more)
    • Excellent adhesive properties
    • Excellent heat resistance
    • Trigger curing ability (mainly for bonding)
    • One-part heat-curing adhesive
    • Low halogen content
    • One-part heat-curing adhesive
    • Low halogen content