Product List
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- One-component heat-curable adhesive
- Low-temperature curable
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- One-component heat-curable adhesive
- Low-temperature curable
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- Single-component heat-curable adhesive
- With thixotropic properties
- Good shape retention capability
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- One-part thermosetting adhesive
- High solder heat resistance
- High thermal shock resistance
- Excellent shear adhesive strength and peeling adhesive strength
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- One-component, heat-curable adhesive
- Small change in flowability with time ensures stable work.
- Good adhesion to various members
- Excellent moisture resistance
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- Single-component heat-curable adhesive
- Low outgassing
- Good tracking resistance
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- Heat-curable, one-component adhesive
- Low viscosity product
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- Heat-curable, one-component adhesive
- Highly thixotropic
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- One-component heat-curing adhesive
- With high glass transition temperature
- With low linear expansion coefficient
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- One-component, heat-curable adhesive.
- With high glass transition temperature.
- Excellent lap shear strength and peel strength.